New Products

Abstract

A new development in palladium‐nickel processes is available from Engelhard. ‘Pallnic’ II is an improvement on the established market leader ‘Pallnic’ which was designed to function as a substitute for acid hard gold deposits used in connectors, printed circuits and other electronic components. ‘Pallnic’ II uses a novel palladium complex to improve the deposit and electrolyte properties even further, which makes it a very realistic and cost‐effective alternative to gold plating. Two processes are available.

Citation

(1988), "New Products", Circuit World, Vol. 15 No. 1, pp. 75-76. https://doi.org/10.1108/eb046061