Multichip Modules for Advanced Applications
G.L. Ginsberg
(Component Data Associates, Inc., Lafayette Hill, PA, USA)
32
Abstract
This paper discusses the increasing activity being directed towards microminiature multichip module packaging. It shows new substrate materials that are being investigated, including multilayer thin‐film ceramics and silicon wafers. Wire bonding, tape‐automated bonding (TAB), and flip device termination techniques are covered. Particular attention is given to the use of multichip modules for advanced data processing applications.
Citation
Ginsberg, G.L. (1990), "Multichip Modules for Advanced Applications", Circuit World, Vol. 17 No. 1, pp. 5-9. https://doi.org/10.1108/eb046106
Publisher
:MCB UP Ltd
Copyright © 1990, MCB UP Limited