PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System: Part 4: The Future of the FBE Process

Abstract

In the preceding three parts of this series, the authors have extensively reviewed and quantified the special processing sequences required for the ‘additive’ and ‘semi‐additive’ process strategies of PWB manufacture. In this, the fourth part of the series of five, they wish to present a series of full build processes which meet all the interconnect requirements of the 1990s while eliminating the drawbacks traditionally associated with additive processes.

Citation

Minten, K., Kitchens, K. and Cisson, J. (1994), "PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System: Part 4: The Future of the FBE Process", Circuit World, Vol. 20 No. 3, pp. 5-14. https://doi.org/10.1108/eb046257