Fluxless Wave Soldering
D.M. Tench
(Rockwell International Science Center, Thousand Oaks, California, USA)
J.T. White
(Rockwell International Science Center, Thousand Oaks, California, USA)
D. Hillman
(Collins Avionics and Communications Division, Rockwell International, Cedar Rapids, Iowa, USA)
G.K. Lucey
(Army Research Laboratories, Adelphi, Maryland, USA)
T. Gher
(Army Research Laboratories, Adelphi, Maryland, USA)
B. Piekarski
(Army Research Laboratories, Adelphi, Maryland, USA)
22
Abstract
Fluxless wave soldering in a nitrogen atmosphere was investigated for epoxy‐fibreglass circuit board coupons having bare copper and solder‐coated through‐holes. The Reduced Oxide Soldering Activation (ROSA™) pretreatment was found to consistently provide good hole filling and through‐hole solder joints of excellent appearance. For preheated coupons, low levels of residual oxygen and short exposure to air after the ROSA treatment were found to have no effect
Citation
Tench, D.M., White, J.T., Hillman, D., Lucey, G.K., Gher, T. and Piekarski, B. (1995), "Fluxless Wave Soldering", Circuit World, Vol. 21 No. 2, pp. 44-45. https://doi.org/10.1108/eb046303
Publisher
:MCB UP Ltd
Copyright © 1995, MCB UP Limited