New high performance, punchable, epoxy/glass laminate

Abstract

Low Shrinking: Epoxies react with their hardeners by direct addition, without the evolution of volatile by‐products and with very little chemical rearrangement. Unlike phenolics and polyesters, the epoxies exhibit very low shrinkage during cure. Abstract—A new punchable high performance epoxy/glass printed circuit laminate has been developed. It is designed to replace more costly and troublesome composite type laminates commonly used in high volume electronic assemblies using two‐sided boards with plated‐through holes. The excellent punching and plating characteristics, coupled with electrical properties equal to those of FR‐4, should make this laminate attractive to all those involved in high quality electronics. This paper was originally presented at the First Printed Circuit World Convention held at the Cafe Royal, London in June 1978.

Citation

Schor, R. (1978), "New high performance, punchable, epoxy/glass laminate", Circuit World, Vol. 4 No. 4, pp. 22-23. https://doi.org/10.1108/eb059975