Silway enters European ASSP and ASIC market with proven design and production facilities

Citation

(1999), "Silway enters European ASSP and ASIC market with proven design and production facilities", Microelectronics International, Vol. 16 No. 2. https://doi.org/10.1108/mi.1999.21816bab.014

Silway enters European ASSP and ASIC market with proven design and production facilities

Silway enters European ASSP & ASIC market with proven design and production facilities

Keyword Silway

Silway, recently formed by EGP Holdings, France, has this week announced a new European ASSP & ASIC venture offering an integrated, cost-effective route to design services, manufacture, test and assembly.

The new operation brings together the established design capabilities of MISIL Technologies (Paris and Bordeaux) with the design and manufacturing skills of Silway semiconductor, its Bulgarian-based production facility. In all, it comprises 60 design engineers and a further 100 electronics engineers and operators.

The three groups are linked via an internal communications network forming a design unit capable of implementing a wide variety of applications, with a particular focus on mixed analog/digital, high voltage and high gate density technologies. The design groups have a proven record of 450+ design completions; Silway will build on this experience, concentrating on telecommunications, automotive, consumer and contact-less (smartcard) applications.

Silway's production facility, based in Sofia, offers a very cost-effective 2 micron, double-poly process. Also in production is a high voltage (250V now; 400V in 1999) process with bipolar features. The lab is currently migrating to a 1.2 micron double poly, doublemetal process. State-of-the art (to 0.25 micron) requirements are handled through strategic partnerships established with major wafer fabrication companies. The lab operates a TQM quality system and plans to offer ISO 9002 certification next year.