Citation
(2002), "IMAPS Nordic", Microelectronics International, Vol. 19 No. 2. https://doi.org/10.1108/mi.2002.21819bab.002
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
IMAPS Nordic
IMAPS Nordic The IMAPS Nordic Conference 2002
Venue: Globe Hotel, Stockholm, Sweden Date: 29 September - 02 October 2002
Readers are welcome to submit an abstract to the IMAPS Nordic Conference 2002.
The abstract must be non-commercial and submitted in electronic form to conference@imapsnordic.org no later than 20 April 2002. Speakers will be notified of paper acceptance by email by 31 May 2002. The deadline for the final paper is 20 July 2002.
Proposed topics include:
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Microelectronics applications
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Trends in telecommunications
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Ceramics for future electronics
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Unique materials, encapsulation, and underfills
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Microvia, HDI laminates
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CSP, flip chips, area array packages
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Bare die, MCM and 3D packaging
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Future electronics, strategies, and R&D
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Reliability assessment
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Advanced interconnect
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Integrated passives and System in Package (SiP)
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System cost assessment
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Pb and halogen free electronics
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Assessing environmental impact
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MEMS, MOEMS, opto, medical, harsh environment applications
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High frequency packaging
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Introducing new technologies to the production floor
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Break-through achievements in the Nordic countries
For the latest information about the conference and the exhibition, visit our homepage at http://www.imapsnordic.org or send email to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org . The Globe hotel homepage is at http://www.globehotel.se