KS 75: Post-reflow solder joint inspection with inherently low false calls

Citation

(2002), "KS 75: Post-reflow solder joint inspection with inherently low false calls", Microelectronics International, Vol. 19 No. 2. https://doi.org/10.1108/mi.2002.21819bad.001

KS 75: Post-reflow solder joint inspection with inherently low false calls

KS 75: Post-reflow solder joint inspection with inherently low false calls

Keywords: Solder, Inspection, Cyberoptics

CyberOptics has introduced the KS 75 AOI (automated optical inspection) system for solder joint inspection and component defect detection. KS 75 uses high-resolution color imaging and proprietary SAM software to identify SMT and through-hole defects at the post-reflow or post- wave stage of production, with inherently low false calls.

The post-reflow inspection capabilities include: Identifying bridges on leaded devices including ultrafine-pitch QFPs; Locating missing, insufficient or excess solder and verifying presence, identity, polarity and location of components as small as 0201's.

The system employs Statistical Appearance Modeling (SAM), knowledge-based software that learns for itself how to recognize good solder joints thus eliminating the need for finely-tuned algorithms. Because SAM is inherently more capable of analyzing and recognizing variations in good solder joints, without sacrificing the ability to identify defects, false calls are minimized, decreasing over time to exceptionally low levels.

The KS 75 system includes a built-in conveyor with automatic width adjustment and Process Advisor software tools for analysis and SPC. A rework station and an off-line programming station are available as options (Plate 1).

Plate 1