Keywords
Citation
(2003), "NanoVia announces MultiDice™ wafer dicing technology", Microelectronics International, Vol. 20 No. 1. https://doi.org/10.1108/mi.2003.21820aad.009
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
NanoVia announces MultiDice™ wafer dicing technology
NanoVia announces MultiDice™ wafer dicing technology
Keywords: Dicing, Technology, Semiconductors
NanoVia, LP has announced the development of an optical beam delivery system specifically tailored to improving the throughput of laser-based semiconductor wafer dicing processes. Using a patent pending dual and triple wavelength technology, the MultiDice™ platform provides pre-removal of first layer materials, including low-k dielectric and other coatings that are either brittle or at risk of damage due to specific laser wavelengths.
NanoVia’s latest optical system MultiDice™ will utilize a laser with multiple UV and IR wavelengths. Present tests show potential increased throughput of 60 per cent over current dicing methods, with a projected target of nearly 100 per cent with newer high power lasers being developed by its laser vendor.
Anticipating the need for extreme high-speed processes to support the HDI roadmap in the US and in Asia, NanoVia has made its top priority the development of new technologies to meet the demands of the HDI marketplace; most specifically in IC packaging processes.