International IEEE conference on Asian Green Electronics (AGEC)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2003

79

Keywords

Citation

(2003), "International IEEE conference on Asian Green Electronics (AGEC)", Microelectronics International, Vol. 20 No. 2. https://doi.org/10.1108/mi.2003.21820bab.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited


International IEEE conference on Asian Green Electronics (AGEC)

International IEEE conference on Asian Green Electronics (AGEC)

23-24 June 2003, City University of Hong Kong, Hong Kong25-27 June 2003, Mission Hills Resort, Shenzhen, China

Keywords: IEEE, Conferences, Asia

You are cordially invited to submit papers to the International IEEE Conference on Asian Green Electronics (AGEC). The conference will be held in Hong Kong and Shenzhen, China (transportation to Shenzhen from Hong Kong will be provided). The purpose of the conference is to present the latest advancements in environmentally compatible electronics design, manufacturing and packaging technology. The goal is to help electronics companies design and manufacture green electronics products for the global market.

An electronic form of a one-page, 300 words abstract with name, address, phone and fax numbers, and E-mail address must be submitted to the technical committee by E-mail at wywong@ee.cityu.edu.hk on/before 28, March 2003.

For more information, visit our Web site: www.calce.umd.edu/agec.htm

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