Keywords
Citation
(2003), "BTU International joins SECAP", Microelectronics International, Vol. 20 No. 2. https://doi.org/10.1108/mi.2003.21820bab.009
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
BTU International joins SECAP
BTU International joins SECAP
Keyword: SECAP
BTU International, a leading supplier of thermal processing solutions to the semiconductor packaging market, has joined the semiconductor equipment consortium for advanced packaging (SECAP). BTU International will install a Paragon wafer bump reflow system with fully integrated automated handling and flux coating in the 300mm Unitive-SECAP line at Unitive Taiwan and will be a primary member of SECAP. With BTU's participation, SECAP adds a proven solder bump reflow process solution to its equipment portfolio, enabling SECAP to serve the packaging community with a truly integrated offering.
The reflow process is used to form homogeneous solder spheres that create a metallic interconnect phase between under bump metalization and solder. For the reflow system, precise control of thermal uniformity and high purity nitrogen atmosphere, as well as efficient flux vapor management are required to ensure reliable adhesion of the solder bump to the wafer and later to the package or printed circuit board. The process is one of the critical aspects of solder bumping because of its influence on the reliability of solder joints. For SECAP, it is therefore important to have this technology in the consortium.