New technology boosts Cobar materials performance

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 1999

35

Keywords

Citation

(1999), "New technology boosts Cobar materials performance", Soldering & Surface Mount Technology, Vol. 11 No. 1. https://doi.org/10.1108/ssmt.1999.21911aad.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


New technology boosts Cobar materials performance

New technology boosts Cobar materials performance

Keywords Cobar, Soldering

New standards in no-clean soldering flux and solder paste performance have been achieved by Cobar BV of Breda, Holland with a major reformulation of its range. The result of a decade-long programme of R&D, the new Cobar M-factor technology materials offer significant advances in virtually every aspect of PCB soldering chemistry. They are distributed in the UK by Parkheath Ltd of Cardiff.

Parallel research programmes at Cobar were aimed at improving activator technology, synthetic polymers and surface chemistry. The use of differential scanning calorimetry (DSC), thermo-gravimetric analysis (TCA) and advanced rheometry have produced fluxes and solder pastes which give reliable, repeatable results in a much larger quality window.

Solder pastes using the new technology print better and faster, giving virtually unlimited tack time and open time. Approved for use with direct imaging printing, they leave virtually no residue and will not spatter or form solder balls.

For further information, please contact: Terry Morgan, Parkheath Ltd, East Moors Business Park, East Moors Road, Cardiff CF1 5JX, UK. Tel: +44 (0) 222 462230.

Related articles