Keywords
Citation
(1999), "Microtech introduces OSP process to eliminate 'tombstoning'", Soldering & Surface Mount Technology, Vol. 11 No. 1. https://doi.org/10.1108/ssmt.1999.21911aad.006
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
Microtech introduces OSP process to eliminate 'tombstoning'
Microtech introduces OSP process to eliminate "tombstoning"
Keywords Microtech, Preservatives, Printed circuit boards
Microtech (http://www.microtech-group.ltd.uk) has introduced an OSP line using Lektrachem's OrgasolSMT multi-solderable selective pre-flux process. The new process is being used for manufacturing high density circuit boards used in telecommunications and data processing applications.
OSP (organic solderability preservative) finishes are particularly suitable for boards with a high density of surface mount components because they give a better standard of flatness than alternative nickel-gold or solderless techniques. As a result "tombstoning" is significantly reduced.
The elimination of copper/tin intermetallics improves solderability as well. Furthermore, as the finish can withstand three or four successive heat treatments, it is well suited to double-sided production.
Further information Tel: +-44 (0) 1952 588222; Fax: +44 (0) 1952 583510.