BTU introduces new controlled atmosphere furnace

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 1999

54

Keywords

Citation

(1999), "BTU introduces new controlled atmosphere furnace", Soldering & Surface Mount Technology, Vol. 11 No. 1. https://doi.org/10.1108/ssmt.1999.21911aad.007

Publisher

:

Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


BTU introduces new controlled atmosphere furnace

BTU introduces new controlled atmosphere furnace

Keywords BTU, Furnaces

New from BTU International (http://www.btu. com) is the transheat controlled atmosphere furnace (TCAS) capable of both high and low temperature C4 reflow applications. The TCAS provides the temperature and atmospheres required for wafer bump reflow, chip interconnect reflow, BGA reflow, final underfill and sealing cure.

Designed to operate with nitrogen, hydrogen or a mixture of both gases, the TCAS unique atmosphere control system features BTU patent gas barriers integrated into BTU's fail safe process gas control system to provide maximum atmosphere integrity.

Developed specifically to meet the the demanding requirements of C4 reflow, the TCAS encompasses semiconductor manufacturing disciplines to achieve better than Class 1000 clean room specification necessary for this process. A fully gas tight process chamber throughout the heated and cooling sections permits oxygen levels of less than 2ppm to be maintained and hydrogen purity of over 95 percent. Critical parameters are monitored by the BTU control unit which automatically shuts off the process gas flow and purges the process chamber if pre-set limits are exceeded.

The TCAS conveyor belt drive system is uniquely designed to minimise friction between the conveyor belt and parts of the furnace which come in contact with the moving belt. The use of special low friction materials in the process chamber, entry and exit sections, and completely enclosed return track, ensure that dust in the process chamber is reduced to the minimum. A fully integrated cassette to cassette handling system is available with the furnace for both eight inch and twelve inch wafers.

Temperature control in each of the multiple heated zones is achieved using a closed loop system maintaining values programmed into the furnace control unit via BTU's WINCON™ software. Heaters are located above and below the process chamber with side heaters also available. In the product cooling stages of the process chamber, BTU's patented eductor system provides more efficient and controlled cooling than conventional water cooled heat exchangers alone.

For further information please contact: BTU Europe Limited, 14 Armstrong Mall, Southwood Summit Centre, Farnborough, Hampshire GU14 ONR, UK. Tel: +44 (0) 1252 660010; Fax: +44 (0) 1252 660011; E-mail: sales@btu.co.uk URL www.btu.com

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