Multicore takes the guesswork out of reflow soldering

Citation

(1999), "Multicore takes the guesswork out of reflow soldering", Soldering & Surface Mount Technology, Vol. 11 No. 2. https://doi.org/10.1108/ssmt.1999.21911bad.007

Multicore takes the guesswork out of reflow soldering

Multicore takes the guesswork out of reflow soldering

Keywords Multicore, Ovens, Reflow, Soldering

The new Slimline SoldaPro Oracle from Multicore Solders allows refiow ovens to be set up more quickly and accurately than ever before. The instrument forecasts the correct oven settings to achieve any target thermal profile indicated by the user (Plate 1).

Slimline SoldaPro Oracle has been developed by Multicore Solders' Soldering Process Control Instruments Division (SPCID). This is the first time a refiow profiling instrument has featured artificial intelligence, enabling it to learn the behaviour of the oven, the individual PCB and the components as it passes through the system. The instrument can compensate automatically for any errors in the calibration of the oven's conveyor, and for differences in thermal load between components, thermal spill over from one zone to the next and modifications to oven gas velocities. Also, as the performance of the oven changes over time and after cleaning, the system is aware of these variations and can automatically adjust its forecasts to suit.

Plate 1 Using Multicore Slimline SoldaPro Oracle, the user defines the required profile and the instrument offers a reliable forecast of the system settings needed to achieve it

The resulting knowledge database is used to calculate the necessary settings to achieve the correct thermal profile. New statistical features include automatic gradient measurement and enhanced limit handling. Oven and PCB descriptions are added to each profile. This includes provision for a graphic showing thermocouple positions and PCB layout.

Forecast settings can be generated to achieve a recommended thermal profile for the solder cream used, or to match a profile defined by the user based on previous experience. Recommended profiles for Multicore solder creams are available on disk or via email from Multicore Solders. The user adds extra constraints as required, and the system responds with go/no-go indicators for each parameter and each thermocouple channel. With Slimline SoldaPro Oracle, a library of thermal profiles can be stored with appropriate oven settings, calculated according to the characteristics of the soldering environment.

An evolution of the Slimline SoldaPro, the new instrument features the same 13mm high, 6-channel data logger, suitable for use with standard and inert gas refiow systems. Temperature range is 0-400šC, and sample interval is adjustable from 0.25 seconds to 99 hours.

Further information is available from Les Evans, Multicore Solders Ltd, Kelsey House, Wood Lane End, Hemel Hempstead, Hertfordshire HP2 4RQ, UK. Tel: +44 (0) 1442 233233; Fax: +44 1442 269554; Email: LGEvans@Compuserve.com