New Ultra Fast(TM) UV curing adhesives

Citation

(1999), "New Ultra Fast(TM) UV curing adhesives", Soldering & Surface Mount Technology, Vol. 11 No. 3. https://doi.org/10.1108/ssmt.1999.21911cad.011

New Ultra Fast(TM) UV curing adhesives

New Ultra Fast™ UV curing adhesives

Keywords Intertronics, Curing, Adhesives

Intertronics have introduced a new line of curing UV and visible curing adhesives that forms bonds to plastics, 100 percent faster than typical UV curing adhesives. Cures occur upon exposure to wave lengths from 200-500 nanometers producing deeper as well as faster cures. Because these new products, named Ultra Fast™, combine cure mechanisms more sensitive to the spectral output of both visible and UV curing wavelengths, they provide faster and deeper cures with lower intensity, using less expensive lamps.

Ultra Fast™ products provide the performance advantages of "bond on demand" assembly, i.e. no cure until adhesive is exposed to light, allowing precise alignment of parts and generous adjustment time prior to instant light-driven cure. Grades are also available that cure with chemical activators or heat to form bonds between opaque, metal and other surfaces.

Ultra Fast™ adhesives are 100 percent solvent and ODC free. Along with their excellent depth and speed of cure, these solvent-free products are an ideal replacement where elimination of ODCs or ODC containing adhesives is desired. Crazing of plastics is also eliminated through use of safe, convenient Ultra Light-Weld adhesives.

Further information from Peter Swanson at Intertronics. Tel: +44 (0)1865 842842.