New PCB transport system from Siemens increases throughput significantly

Citation

(1999), "New PCB transport system from Siemens increases throughput significantly", Soldering & Surface Mount Technology, Vol. 11 No. 3. https://doi.org/10.1108/ssmt.1999.21911cad.012

New PCB transport system from Siemens increases throughput significantly

New PCB transport system from Siemens increases throughput significantly

Keywords Siemens, Placement, Printed circuit boards, Throughput

Siemens has announced the launch of its revolutionary printed circuit board (PCB) transport system, SIPLACE Productivity Lift, that allows manufacturers to arrange placement machines in a traditional in-line configuration while obtaining the benefits of parallel line manufacturing (Figure 1).

Figure 1 The SIPLACE productivity line: process flow diagram

SIPLACE Productivity Lift is a patented system that increases throughput by reducing the impact of secondary times on the PCB production process. Targeted at OEMs and contract manufacturers with high volume requirements, this transfer time reduction results in a throughput increase ranging from 15 to 125 percent, depending upon the PCB application.

The SIPLACE Productivity Lift is a conveyance system that increases machine availability and productivity. It automatically routes an unpopulated PCB to the first available SIPLACE placement machine, regardless of the machine's position in the production line.

During production, the Productivity Lift automatically transports the unpopulated board underneath the placement machines until it reaches a machine that is available to accept the board. Then, the Productivity Lift raises the unpopulated board back to standard transfer height for further processing. This innovative process allows the parallel production in a series configuration.

"Today's decision makers at electronics manufacturing companies are under a lot of pressure to make choices about production equipment based on how the investment will impact on the company's bottom line", said Ray Bruce, general manager of Siemens Automation ­ SMT. "The SIPLACE Productivity Lift offers an innovative solution that addresses their concerns; the system essentially eliminates non-productive machine time, which, in turn, dramatically increases throughput. Furthermore, the gain in assembly equipment productivity also translates into a gain for additional process equipment in the production line, such as screen printers and ovens. Therefore, equipment utilisation is maximised, resulting in greater profits for the company."

The flexible design of the Productivity Lift does not affect the time it takes to reconfigure a SIPLACE production line. To change the manufacturing process, the line operator can simply re-programme the modules in only a few minutes. The flexible design of the system allows the user to change applications quickly, without sacrificing throughput.

The SIPLACE Productivity Lift can be integrated with all SIPLACE equipment; the SIPLACE HS 50, 80 S 20 and the new 80 S 23 (HM) high-speed machines; the 80 F4 and 80 F5 high-flexibility machines.

For further information please contact: Madeline Pedley, Siemens Automation ­ SMT, Sir William Siemens House, Princess Road, Manchester M20 2UR, UK. Tel: +44 (0)161 446 6645; Fax: +44 (0)161 446 5280; E-mail: pedleym@plcman.siemens.co.uk http://www.siemens-industry.co.uk