New via plug ink enables void-free hole filling

Citation

(1999), "New via plug ink enables void-free hole filling", Soldering & Surface Mount Technology, Vol. 11 No. 3. https://doi.org/10.1108/ssmt.1999.21911cad.015

New via plug ink enables void-free hole filling

New via plug ink enables void-free hole filling

Keywords Multicore, Solder pastes

LS-101S from Multicore is specifically engineered and optimized by PTF technology specialist ASAHI for high performance via plug applications. The paste reportedly displays outstanding printability and the rheology has been precisely tuned to achieve complete via filling with no voids on curing even with aspect ratios as high as 6:1.

A careful balance of conductive phases, resins, hardeners and additives produces the optimum properties to eliminate contamination of adjacent pads yet retain a simple "hands free" print process using conventional stencil print equipment. The planarization process also benefits from the applications focus of the formulators, as the pre-cure hardness can be exactly targeted for ease of processing and perfect results. The final cure of 30 mins at 150°C is typically lower than alternative technologies, reducing thermal stress on the system and ensuring no cracks arise in the through holes. LS-101S allows electroless or electrolytic plating with conventional chemistries and has been proved completely reliable in both pad on via and microvia applications.

LS-101 offers benefits to the PWB producer in both the micro and macro areas of:

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  space saving pad on via designs;

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  low cost blind and buried vias;

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  thermal pillars for heat dissipation;

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  reduction of process steps and copper plating on SBU boards;

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  enhanced conductivity of through holes.