WESCON Spring 2001 and new EtroniX event co-locate to provide solutions across the supply chain

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2000

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Citation

(2000), "WESCON Spring 2001 and new EtroniX event co-locate to provide solutions across the supply chain", Soldering & Surface Mount Technology, Vol. 12 No. 3. https://doi.org/10.1108/ssmt.2000.21912cac.004

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


WESCON Spring 2001 and new EtroniX event co-locate to provide solutions across the supply chain

WESCON Spring 2001 and new EtroniX event co-locate to provide solutions across the supply chain

On 25 February, 2001 the doors of the Anaheim Convention Center will open to reveal the most complete trade event for the OEM electronics community ever staged. The Electronics Group of Reed Exhibition Companies (REC) and Electronic Conventions Inc. announce the co-location of EtroniX and WESCON Spring.

EtroniX, the new electronics technology umbrella event, will feature several vertical events: dEsign Expo, e/mfg expo, Advanced Packaging International, EvaluTech, and NEPCON Production and Support. WESCON Spring/2001, North America's Component Technology Event, completes the supply chain by bringing one of the most critical pieces affecting the electronics industry today.

"Electronics manufacturers are increasingly looking to their supply chains to maximise efficiencies, and component technology has represented a key area of focus," said John Moriarty, Event Director for EtroniX. "This unique venture is the major step required to bring the entire electronics industry under one roof." he continued.

EtroniX and WESCON Spring will be held 25 February – 1 March, 2001 in Anaheim, California.

Further information: Reed Exhibition Companies. Tel: +1 800 467 5656 or Electronic Conventions, Inc., Tel: +1 800 877 2668.

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