Automation offer "reworked" rework station

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2001

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Keywords

Citation

(2001), "Automation offer "reworked" rework station", Soldering & Surface Mount Technology, Vol. 13 No. 2. https://doi.org/10.1108/ssmt.2001.21913bad.010

Publisher

:

Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


Automation offer "reworked" rework station

Automation offer "reworked" rework station

Keywords: Automation, Rework

Automation are supplying the Freedom 3000 Rework Station from Conceptronic. Freedom 3000 is an advanced, easy-to-use BGA rework and replacement system. Devices are placed, soldered and removed and this machine is best suited for BGA, CSP, flip-chip or leaded components. The system is ideal for rework and production uses.

A user-friendly interface is achieved through Windows™ based software and an automated optics system. The software incorporates features normally available on more technically advanced reflow soldering ovens, making it possible to control the process through thermal profiling and editing of heating parameters. This facility enables repeated thermal processing of complex components from "low-mess" PCBs to large "high-mass" PCBs up to 50.8cm x 50.8cm in size.

Powerful top and bottom heating applies precise intensities of forced convective energy directly to the component and board. Any combination of gas velocity, temperature and heater height can be configured to adjust the heating rate. The zone controlled honeycomb IR bottom-side pre-heater is well suited for "high-mass" assemblies due to the large surface area and high heat transfer coefficient. This enables rapid soldering whilst still maintaining decreased temperature deltas, preventing board warp.

The Freedom 3000's placement accuracy is achieved via "component-to-pad" vision/alignment system, spring loaded work board holder and integral vacuum pick-up system. It is possible to place flip chips with bump spacing as low as 0.004" (0.1mm), whilst also placing BGA, CGA, QFP, PLCC, TSOP, CSP on boards with a component height clearance of up to 61mm achievable.

Further details: Sarah Jones, Automation Ltd; Tel: +44 (0)1256 473141; Fax: +44 (0) 1256 461232. E-mail: sales@automation.ltd.uk; Web site: http://www.automation.ltd.uk

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