Citation
(2002), "New alliance in the SMT arena", Soldering & Surface Mount Technology, Vol. 14 No. 1. https://doi.org/10.1108/ssmt.2002.21914aab.008
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
New alliance in the SMT arena
Assembléon and Cookson Electronics' Speedline Technologies have joined forces to provide SMT manufacturers with best-of-breed equipment and integrated line solutions (Plate 1).
Assembléon and Speedline announce a groundbreaking strategic alliance. The Alliance combines the wide-ranging expertise and resources of these industry-leading organisations, merging Assembléon's strengths in pick-and-place systems and processes, and Speedline's expertise in equipment, systems and processes.
Plate
1 New alliance in the SMT arena
For further information contact Wenny Hageman, Assembléon, Regional Centre Europe, Building HVM, PC Box 216, 5600 MD Eindhoven. Telephone: +31 4027 66444. Fax: +31 402766541, Email: wenny.hageman@philips.com