Citation
(2002), "New convertible head flip chip bonder", Soldering & Surface Mount Technology, Vol. 14 No. 1. https://doi.org/10.1108/ssmt.2002.21914aad.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
New convertible head flip chip bonder
A new development of the PESL. DB5-TSV vertical head ultrasonic flip chip bonder flow allows for rapid conversion to horizontal ultrasonics and with standard head it enables use as a highly accurate pick and place machine (Plate 1).
The vertical ultrasonic head enables improved planar attachment of very fragile chips such as galium arsonide and for some of the very small microwave chips presently in development. Conventional gold bump chips can then be bonded using cither horizontal or vertical ultrasonics, involving only a very quick and simple change of the active head unit.
Plate
1
Further information regarding PFSL products may be found at: www.pesl.win-uk.net.