Citation
(2002), "Dexter introduces 260°C reflow silver-filled conductive adhesive", Soldering & Surface Mount Technology, Vol. 14 No. 1. https://doi.org/10.1108/ssmt.2002.21914aad.002
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Dexter introduces 260°C reflow silver-filled conductive adhesive
Dexter Electronic Materials has introduced QMI 526, a silver-filled thermally conductive adhesive used to attach integrated circuits and components to advanced substrates including PBGAs, CSPs, stacked die, and array packages based on flexible tape and organic laminates. This low stress material is designed for use with large die (.500 mil) or for applications where the substrates' co-efficients of thermal expansion (CTE) differ substantialy. This product is qualified to perform in lead-free, 260°C reflow applications.
Thermally conductive, hydrophobic, and stable at high temperatures, the new adhesive delivers void-free bond lines with excellent adhesive strength on a wide variety of organic and metal surfaces including solder mask, BT FR, polyimide,gold, Kaptone, and Mylare. QMI 526 offers a robust adhesion mechanism that can compensate for the presence of fluorine or other backside residues, for example on wafers. The adhesive also offers excellent electrical properties.
Designed to achieve UPHs substantially higher than conventional oven cures, it is formulated to cure in-line either on the diebonder using a post- diebond heater or on the wirebonder preheater. QMI 526 can be cured in-line using Skip-Curee processing in just 8 seconds at 150°C, or using a variety of times and temperatures in conventional ovens or snap cure stations.
For more information visit: www.loctite.com/electronics.