SMTA. Boston to feature three leading edge events

Citation

(2002), "SMTA. Boston to feature three leading edge events", Soldering & Surface Mount Technology, Vol. 14 No. 2. https://doi.org/10.1108/ssmt.2002.21914bab.007

SMTA. Boston to feature three leading edge events

Keywords: SMTA

The SMTA is organizing three exceptional events for SMTA Boston, in conjunction with NEPCON East and Electro 2002, on June 10-12 at the Bayside Convention Center in Boston, MA.

First, the SMTA is featuring its Academy Program on June 10-12. Full- and half-day courses will cover topics including Surface Mount Attachment Reliability, New & Emerging Technologies, Stencil Printing, Lead-Free Technology, Assembly for Optical Communication, Ball Grid Array Design and Assembly, Flip Chip Assembly and Applications, Surface Mount Technology Fundamentals, SMT Troubleshooting, Advanced Component Packages & Processes, Design for Manufacturability, and Process Control.

Instructors for the Boston Academy include Dr. Robert Kotlowitz, Lucent Technologies; Dr. Jennie Hwang, H-Technologies Group; Dr. Ronald Lasky, Indium Corporation of America; Marie Cole, IBM Microelectronics; George Riley, FlipChips Dot Com; Prof. S. Manian Ramkumar, Rochester Institute of Technology; Phil Zarrow and Jim Hall, ITM; Karen Walters, BTU International; and Karl Fischback, ECD.

The SMTA will also feature its Third Annual Advanced Technology Symposium on June 11 and 12. The symposium will consist of two days of paper sessions with experts from throughout the packaging industry who will discuss the most recent advances in electronic and optoelectronic assembly technologies.

The first day will focus on advanced electronics assembly technologies, and sessions will address Materials Issues and Board Assembly. The next day will begin with a look at current reliability issues in board assembly and then focus on optoelectronics. Sessions for day-two will address Reliability Issues in Advanced Packaging; State-of- the-Art in OE, MEMS, and MOEMS Packaging; Packaging and Hermeticity for OE Components; and Assembly Practices for Optical Fibers.

Conference chairpersons for the Third Annual Advanced Technology Symposium are Dr. Paul Vianco, Sandia National Labs, and Dr. Ken Gilleo, Cookson Electronics.

Lastly, a new event this year is "Board Talk" with Phil Zarrow and Jim Hall of ITM Consulting on June 11 from 1:30-3pm. The purpose of this forum is to cut through the marketing hype and the platitudes of board assembly and to further the technical levels of the industry. The cost is just $20/$25 for SMTA members/non-members. All proceeds from Board Talk are being donated to the Charles Hutchins Educational Grant.

Visit the Education section at smta.org or contact SMTA director of education Kristin Stromberg for more details: kristin@smta.org or 952-920-7682.