Citation
(2003), "Cobar debuts “Solder-Ball Killer” wave soldering flux", Soldering & Surface Mount Technology, Vol. 15 No. 1. https://doi.org/10.1108/ssmt.2003.21915aad.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Cobar debuts “Solder-Ball Killer” wave soldering flux
Cobar debuts “Solder-Ball Killer” wave soldering flux
Cobar Europe BV has announced the introduction of a new Low-VOC wave soldering flux, Cobar 94-QMB, designed to serve the most critical automotive electronics manufacturing applications. This flux has been shown to be effective in solving a key recurrent problem known as solder ball formation adjacent to plug-in connectors on some assemblies (Plate 6).
Plate 6
The new Low-VOC wave soldering flux
Many great automotive electronics assemblies typically involve large plug-in connectors. These connectors may be comprised of polymers that have a glass transition (GT) temperature that is actually too low to withstand the temperatures of the wave soldering process that is employed to attach them to the board. Consequently, when the assembly passes through the solder wave, the protruding connector pins are heated up beyond the GT temperature of the polymer. The material softens and the solder adheres to some extent, but upon exiting the solder wave, the malformed mass of solder that is stuck to the connector pins solidifies into one or more solder balls.