Keywords
Citation
Willis, B. (2003), "Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies", Soldering & Surface Mount Technology, Vol. 15 No. 1. https://doi.org/10.1108/ssmt.2003.21915aae.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies
Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies
Ning-Cheng LeeNewnes270 pp., 12 chapters, illustrations and photographs
Keywords: Reflow, Soldering, Flip chip
It often surprises me how many publishers keep some books a secret. it’s often the case that publishers also fail to tell reviewers how much the book costs and provide a biography of the author. However, it’s always great news to hear about one of the industry’s gurus has written a textbook. It is even better news when is practical, up to date and very informative. Do not bother reading the rest of the review, buy the book!
Ning-Cheng Lee has been around the industry for many years working for Indium Corporation of America. I have always liked the style of his presentations and technical articles. They always remind me of lab reports, detail is given on the problem, what was being done to evaluate the problem, the result and the final conclusion. The material is always practical, easy to understand and implement and the book is an ideal example of his work.
The chapters cover each of the major topics traditional surface mount, BGA, CSP and flip chip. There is also space for the obligatory lead-free section. Like any engineer it’s nice to find some new fresh material not normally included in a book of this type. Ning-Cheng provides a chapter on underfilling and issues relating to in-circuit test probing which are very practical. Some material suppliers may suggest that as Indium make materials, its a great way of promoting products, but that is not the case in the text.
The book is packed with good illustrations and photographs, even a couple of this reviewer’s images have been included on tombstoning. One slightly confusing thing is some of the photographs and X-rays are not actually photographs but artist’s impressions. It may be that the true images could not be obtained, or permission to include, them granted in time for publication. Nevertheless it does not detract from the value in any way.
Great book, well worth the cost and I look forward to the author signing my copy of the book at APEX; he may be rich and famous one day.
Bob Willis