Citation
(2003), "Peak booklet spells out common test mistakes", Soldering & Surface Mount Technology, Vol. 15 No. 1. https://doi.org/10.1108/ssmt.2003.21915aae.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Peak booklet spells out common test mistakes
Peak booklet spells out common test mistakes
The Peak Group has produced a booklet explaining how to avoid the industry’s most common test pitfalls (Plate 10).
Written by Les Bullock, Peak’s Functional Test Development Manager, the booklet is entitled “The five biggest mistakes companies make in electronics test – and how to avoid them”.
Plate 10 The Peak booklet
The report emphasises the importance of defining test strategies at the early design stages and spells out the problems that companies encounter when they fail to consider such key aspects as accessibility and functionality.
For further information, visit: www.thepeakgroup.com