Soldertec Global seeks nominations for Lead-free Solder Awards 2003

Citation

(2003), "Soldertec Global seeks nominations for Lead-free Solder Awards 2003", Soldering & Surface Mount Technology, Vol. 15 No. 3. https://doi.org/10.1108/ssmt.2003.21915cab.005

Soldertec Global seeks nominations for Lead-free Solder Awards 2003

Soldertec Global seeks nominations for Lead-free Solder Awards 2003

Keywords: Soldertec, Lead-free Solder, Awards

Soldertec is offering individuals or organisations involved in the development of lead-free technology the opportunity to apply for one of this year's Lead-free Solder Awards. The awards recognize significant contributions of researchers, engineers or companies to the development and implementation of lead-free electronics soldering during 2003. Applications can be made directly by individuals or organisations, but industry is also encouraged to provide nominations of individuals they feel should be recognized through this award. Applications or nominations should be made by e-mail to tom.perrett@tintechnology.com describing in less than 300 words the work of the individual towards achieving the successful introduction of lead-free electronics. Past awards have been given for leading collaborative research projects, introducing lead-free soldering into production, making particular improvements in process technology or contributing to knowledge through academic studies. Details of the previous award winners are given later.

The deadline for application is 17 October 2003 and the winners will be announced in November 2003.

The Soldertec award was established in 1999 to mark the launch of Tin Technology's Lead-free Soldering Centre (Soldertec) and was granted in its first year to Dr Kenichiro Suetsugu of Panasonic, Japan in recognition of the successful introduction of lead-free soldering in mass production of the portable MiniDisc SJ-MJ30-S.

2000 – Dr James Vincent, of Marconi, for his work as project leader of the European based IDEALS collaborative programme and Professor Tadatomo Suga, Tokyo University, for his leadership of the Japanese NEDO lead-free project.

2001 – Professor Suganuma, Osaka University, for his contribution to the understanding of lead- free materials through continuing research activities, and to Dr Carol Handwerker, of NIST USA, in recognition of her efforts as a key participant of the NCMS project and her involvement in the NEMI lead-free programme.

2002 – Dr Dongkai Shangguan, Director of Advanced Process Technology, Flextronics US and previously of Ford/Visteon, David Bergman, VP Standards, Technology and International Relations, the IPC, and, the Lead-free Component Focus Group, Chaired by Mark Kwoka of Intersil, and with core group members: L. Whiteman (ACI), J. Cannis (Amkor), G. O'Brien (Photocircuits), D. Hillman (Rockwell Collins), M. Toben (Shipley Ronal), and R. Schetty (Technic). These winners reflect a range of activities on lead-free soldering from industrial roadmapping and leadership, to detailed technical studies

For more information visit the Soldertec Web site: www.lead-free.org and for more information about the previous award recipients see: http://www.lead-free.org/research/detail/awards.html