Keywords
Citation
(2005), "NPL develop new instrument for measuring solder properties", Soldering & Surface Mount Technology, Vol. 17 No. 1. https://doi.org/10.1108/ssmt.2005.21917aab.016
Publisher
:Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited
NPL develop new instrument for measuring solder properties
NPL develop new instrument for measuring solder properties
Keywords: Solder
National Physical Laboratory has developed a new instrument for measuring solder properties. With the take up of the new lead-free alloys, there is an imperative to obtain accurate material properties. Today there is a realisation that these properties must be measured on volumes of materials typical of current solder joints (under 1 mm3). This requirement is challenging in terms of instrument sensitivity, requiring the ability to measure and displace small distances, typically a few micrometers to a precision of 0.1 μm, and to measure low forces.
NPL has developed a machine that achieves this capability and is based on a novel configuration. Measurements are now possible at typical stresses and strains found in solder joints, resulting in realistic fatigue and creep rates to be measured. These values are essential for accurate statistically based life-time predictions of lead-free reliability.
This work has been carried out at NPL by Milos Dusek and Crispin Allen.
For further information, contact: Dr Chris Hunt. E-mail: chris.hunt@npl.co.uk; and Milos Dusek. E-mail: milos.dusek@npl.co.uk