Citation
(2008), "International diary", Soldering & Surface Mount Technology, Vol. 20 No. 3. https://doi.org/10.1108/ssmt.2008.21920cac.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2008, Emerald Group Publishing Limited
International diary
Article Type: International diary From: Soldering & Surface Mount Technology, Volume 20, Issue 3
2008
2009 iNEMI Roadmap Workshop – Asia
28 July
Shanghai, China
Contact: For additional information: www.inemi.org
EIPC Workshop on Contract Drilling Routing & Scoring
August, Dates TBA
Graz, Austria
Contact: www.eipc.org
EIPC Joint Conference with Publish House
SeptemberDates and location: TBA
Moscow, Russia
Contact: www.eipc.org
EIPC Workshop on technology, processes and materials for rigid-flex circuitry
SeptemberDates and location: TBA
Contact: www.eipc.org
EIPC Workshop on via hole plugging
SeptemberDates and location: TBA
Contact: www.eipc.org
IPC Midwest
24-25 September
Schaumburg, Illinois, USA
Contact: www.ipc.org
Printed Electronics Asia
7-9 October
Tokyo, Japan
TPCA Show
22-24 October
Taipei, Taiwan
Contact: www.tpca.org.tw
IONMET/PROSURF Dissemination Seminar at ELECTRONICA 2008
11-14 November
Messe München
Contact: www.eipc.org
Printed Electronics US
3-4 December
San Jose, USA
2009Photovoltaics Europe
January
Berlin, Germany