Novatec continues their tradition of breakthrough technologies at Forum de l’electronique

Citation

(2009), "Novatec continues their tradition of breakthrough technologies at Forum de l’electronique", Soldering & Surface Mount Technology, Vol. 21 No. 1. https://doi.org/10.1108/ssmt.2009.21921aab.007

Novatec continues their tradition of breakthrough technologies at Forum de l’electronique

Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 21, Issue 4

Novatec exhibited their continuing array of breakthrough production technologies at the Forum de l’electronique exhibition held in Paris in September. The assembly process specialist responsible for numerous globally recognized inventions demonstrated another effective innovation called ProcessWatch™.

The Novatec team introduced a new suite of production control tools offering track and trace capabilities to small and medium sized organizations without the cost and implementation issues associated with enterprise-wide software alternatives. ProcessWatch enables manufacturers to trace boards and record events throughout the assembly process and keep track of associated consumables, stencils and tooling. Its real time production control capabilities offer benefits to operators, process engineers and quality control managers alike, including stencil/board/tooling compatibilities, materials aging, events alerts, and much more.

The Novatec team demonstrated their Memory Shape Tooling solution VacuNest. Visitors learned how VacuNest provides a unique solution to the problem of securely fixturing bottom side populated assemblies for printing, dispensing and placement, now available for backplanes and similar large format PCBs. Novatec’s Shape Memory Tooling eliminates the many drawbacks of dedicated tools and flexible pin alternatives while providing secure support that removes the risk of component damage due to point force pressures.

Each VacuNest module is a pliable anti-static chamber containing a foam former surrounded by polymer granules. The chamber can be quickly profiled to the shape of the underside of a populated board, and under vacuum that profile can be retained indefinitely and quickly reformed for product changeover in situ, VacuNest modules are available in a range of sizes to accommodate boards up to 540 mm × 540 mm and printing, dispensing and placement machinery from any manufacturer.