Selected papers from HDP’07

Citation

Liu, J., Lu, D. and Andersson, C. (2009), "Selected papers from HDP’07", Soldering & Surface Mount Technology, Vol. 21 No. 2. https://doi.org/10.1108/ssmt.2009.21921baa.001

Selected papers from HDP’07

Article Type: Guest editorial From: Soldering & Surface Mount Technology, Volume 21, Issue 2

Microsystem manufacturing, assembly, packaging and design technology all play important roles in the progress of the microsystems and microelectronics industry throughout the world. In order to establish a forum for the electronics industry, universities and research institutes in China, the ninth International Symposium on High Density Design, Packaging and Microsystem Integration (HDP’07) was organized by the Sino-Swedish Microsystem, Integration Technology Center, Shanghai University, China. This conference was designed to enable regular contacts with the outside world, to create a chance for scientists and engineers both outside and in China to meet together to exchange results of their latest research and development, and to discuss the problems and solutions in the field of microsystem design, packaging and failure analysis, The conference covered many interesting areas and topics, including high-density design and packaging, circuits for CMOS and RF applications, substrate design, MEMS and MOEMS design, packaging and assembly, microsystem and manufacturing issues, component failure analysis techniques, simulation and modeling for microsystems and microelectronics manufacturing processes, thermal management and reliability, OLED, LED and opto-electronics packaging, environment design and materials development, and cost reengineering, improvement and analysis. Over 110 excellent papers were presented at the conference with several parallel sessions, more than 15 keynote and invited papers, and three short courses from well-known world-renowned experts.

In this special issue of Soldering & Surface Mount Technology we are featuring eight important papers from this conference. The first two papers by Li et al. and Zou et al. deal with new solder alloy development including nanosolders of the Sn-Cu-Co system. The following three papers deal with IMC growth and interactions in Sn-Cu alloys with Cu in high-magnetic fields and Ni substrate, interfacial reactions, and aspects of advanced thermal management for Flip Chip on LTCC. The sixth paper reports on thermal cycling of PBGA packages. Finally, the last two papers deal with reliability characterization and modeling of lead-free soldering on SMT and through-hole applications, and the fitting of the Coffin-Manson equation to SnAgCu solder.

Johan Liu, Daoqiang Lu, Cristina Andersson