Citation
(2009), "Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste", Soldering & Surface Mount Technology, Vol. 21 No. 4. https://doi.org/10.1108/ssmt.2009.21921dad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2009, Emerald Group Publishing Limited
Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste
Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste
Article Type: New products From: Soldering & Surface Mount Technology, Volume 21, Issue 4
ALPHA® – Cookson Electronics Assembly Materials have launched ALPHA WS-820 halide-free, lead-free, and water-soluble solder paste. This new product offers outstanding printability with excellent print volume and print repeatability down to 12 mil (0.3 mm) features. it also has an excellent reflow process window with straight ramp and short soak or long soak profiles in air.
Available in SAC305 and SAC405 alloys and in Type 3 and 4 powder, ALPHA WS-820 delivers excellent wetting characteristics on all common surface finishes, including Entek HT OSP. As many electrics assemblers explore the conversion to lead-free water-soluble surface mount applications, WS-820 will allow a wide variety of them make the transition without sacrificing printability and first pass yields.
For more information about ALPHA WS-820, please visit the web site: www.alpha.cooksonelectronics.com