High-temperature electronics packaging solutions for 250°C applications

Citation

(2010), "High-temperature electronics packaging solutions for 250°C applications", Soldering & Surface Mount Technology, Vol. 22 No. 4. https://doi.org/10.1108/ssmt.2010.21922dad.003

High-temperature electronics packaging solutions for 250°C applications

Article Type: New products From: Soldering & Surface Mount Technology, Volume 22, Issue 4

Packaging and assembly systems that can withstand 250°C for prolonged durations have been developed through the UPTEMP Technology Strategy Board project as part of a project to extend electronics into hostile high-temperature environments.

There is a growing desire to install electronic power and control systems in high-temperature environments to improve the accuracy of critical measurements and reduce the cost of cabling from remote and hostile locations. Typical applications include down-hole petroleum/gas/geothermal exploration and production operations and turbine engines for aircraft propulsion and power generation.

This requirement has posed a challenge to the traditional limit of 125°C for high-temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations, and potentially corrosive environments means that different semiconductors, passives, circuit boards, and assembly processes are needed.

The fundamental change required to enable this step change in packaging performance is to switch from traditional soldered surface mount or through-hole packaged devices assembled onto FR4 printed circuit board materials. Instead, designers and manufacturers should use bare dies mounted onto ceramic, insulated metal or polyimide based substrates with selected materials that are intrinsically more capable of withstanding high temperatures for long periods without degradation.

Extensive testing of ceramic and insulated metal substrates and solder/adhesive interconnect materials at temperatures of 250°C for durations of over 2,000 h have been carried out. Thermal migration and other deterioration effects have been observed on several commercially available high-temperature materials and commonly used assembly methods. An alternative set of materials and assembly processes have been developed with proven reliability at temperatures of up to 250°C for the manufacture of active and passive electronic components, suitable for down-well, aero-engine and power generation applications.

This work formed part of the recently-completed UPTEMP project which was established with support from the UK Technology Strategy Board and the EPSRC. The project brought together a consortium of end-users (Sondex Wireline and Vibro-Meter, the UK), an electronic module manufacturer (GE Aviation Systems – Newmarket) and material suppliers (Gwent Electronic Materials and Thermastrate Ltd) with Oxford University’s Materials Department, the leading UK high-temperature electronics research centre (Figure 2).

Figure 2 Performance measurement of high-temperature electronic devices

Web site: www.electroniccomponents.geaviationsystems.com