Preparation of copper nanoparticles and metal-metal bonding process using them

Abstract

This work describes a metal-metal bonding process by the use of Cu nanoparticles as a filler material. The Cu particles used were prepared by reduction of Cu²⁺ with hydrazine in the presence of cetyltrimethylammonium bromide as a dispersing agent (uncoated Cu particles). Polypyrrole (PPy)-coated Cu nanoparticles were also used as the filler. Strong bonding for Cu discs was not obtained by using the PPy-coated particles. For the uncoated Cu particles, a shear strength required for separating the discs bonded by annealing at 400°C in H₂ gas was as large as 18.1 MPa.

Citation

Kobayashi, Y., Ishida, S., Ihara, K., Yasuda, Y. and Morita, T. (2013), "Preparation of copper nanoparticles and metal-metal bonding process using them", World Journal of Engineering, Vol. 10 No. 2, pp. 113-118. https://doi.org/10.1260/1708-5284.10.2.113