Heat transfer modeling of multilayer reactive foil

Abstract

Nanostructured reactive foils have attracted a great deal of interest recently due to their unique mechanical and thermal properties. Reactive thin foil can be used as a controllable, localized heating source for joining applications, which enable soldering and brazing of materials at room temperature. In this paper, multiphysics-based numerical simulations were performed to simulate reactive thin foils. The conductive heat transfer equation and mass diffusion equations were solved for 1D, 2D, and 3D cases. 1D simulation examined the effect of the chemical reaction rate on the flame speed; 2D simulation gave the detailed temperature and composition distribution in the bi-layers; and 3D simulation demonstrated the localized heating effect of reactive thin foils on a silicon wafer substrate.

Citation

Liu, R., Guo, S., Qiu, X. and Wang, J. (2011), "Heat transfer modeling of multilayer reactive foil", World Journal of Engineering, Vol. 8 No. 2, pp. 151-157. https://doi.org/10.1260/1708-5284.8.2.151