Table of contents
Footprints of Fine Pitch SMDs
R.J. Klein WassinkMost footprints of surface mounted components have been calculated on the basis of the sizes and tolerances of their electrodes, taking into account the various inaccuracies of…
Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability
J. Lau, G. Dody, W. Chen, M. McShane, D. Rice, S. Erasmus, W. AdamjeeThe reliability of 0·5 mm pitch, 208‐pin FQFP solder joints has been studied by experimental temperature cycling and 3‐D nonlinear finite element analysis. Temperature cycling…
Advanced Metal Core Substrates as a Solution for Multichip Module Backplanes
T.J. BuckIn future generations, electronic systems will rely extensively on advanced IC technology to achieve higher performance levels. However, with limits placed on the level of…
A New Technology for the Design and Manufacture of Two‐layer and Multilayer ‘Semi‐flexible’ Circuits for Automotive Applications
J. Kemkes, F. Melchior, M. WeinholdInsulated Metal Substrates (IMS) have been used in the automotive industry for a number of years. The popularity of this technology is due to the good thermal conductivity of the…
Vertical Electrostatic Spraying of Photosensitive Resists
A. Hall, M. HemmingWith the growing demand for more complex PCBs with tighter tolerances, there is a need to improve the production capability of solder masks, together with etch and plating resists.
Fine Line Conductor Formation
H. NakaharaDriven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is…
Productronica
Brian EllisProductronica, the 9th International Trade Fair for Electronics Production held in Munich from 12–16 November 1991, more than fulfilled the high expectations placed in this…
International Institute News
The Council of the ICT has recently made a grant to a member in respect of its training courses following the introduction of the scheme earlier in the year.
Industry News
LeaRonal of Buxton, Derbyshire, widely known for its involvement in the development and marketing of an extensive range of speciality chemicals to all sections of industry, have…
New Products
A through‐plating facility designed by Heraeus eliminates the need for electroless copper. The new compact facility, which can handle printed circuit boards measuring up to 250 x…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari