Circuit World: Volume 23 Issue 4

New Base Materials for Future Printed Circuit Boards

M. Huschkta

Higher performance, higherreliability and low cost are the key requirements for today's and tomorrow's printedcircuit boards for SMT and COB applications. The successful…

Surface Leakage Current (SLC) Methodology for Electrochemical Migration Evaluation

Q.N. Xiao, F. Grunwald, K. Carlson

Modern electronics is characterised by the increasing level of integration in printedcircuit board (PCB) technology and the reduced insulation spacing between adjacentconductors…

Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuits

M. Pecht, Y. Ranade, J. Pecht

This paper presents a study to determine the extent to which delamination at the die to encapsulantinterface affects the package moisture content, and electrical failures when…

Environmental Management in Electronics Manufacturing*

B. Richards

Concern over global environmental pollution has resulted in a raft of new legislation, a major impact of whichhas been fundamental re‐evaluation of processing technologies used…

Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip

J.H. Lau

Theexplosive growth of high‐density packaging has created a tremendous impact on theelectronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip ScalePackaging…

Plastic‐encapsulated Microcircuits (PEMs) : Long‐term Dormancy Studies

E.B. Hakim, J. Fink, S.M. Tam, P. McCluskey, M. Pecht

For many years, the concern over the use of plastic encapsulated microcircuits(PEMs) has been their capability to survive in harsh environments over a long termwith continuous or…