Table of contents
Tenting: cost‐effective fabrication of high‐density PWBs for the year 2000 and beyond
John RaineThe objective of this paper is to highlight the advantages of tenting as a process worthy of meeting the current and future challenges of the PWB industry. A further refinement of…
A low‐cost solder‐bumped chip scale package ‐NuCSP
John H. Lau, Chris Chang, Tony Chen, David Cheng, Eric LaoA new solder‐bumped flip chip land grid array (LGA) chip scale package (CSP) called NuCSP is presented in this paper. NuCSP is a minimized body size package with a rigid substrate…
Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading
Shi‐Wei Ricky Lee, Xiaowu ZhangA computational study is presented in this paper to investigate the effect of variation in material properties on the fatigue life prediction of solder joints subjected to cyclic…
Erratum
This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/01445159610117690. When citing the…
Characterization of a non‐woven randomly dispersed short fiber laminate
Michael Pecht, Keith Rogers, Andre FowlerNon‐woven laminates have begun to gain recognition in the electronics industry because they are generally thinner and flatter than woven laminates. This study characterizes the…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari