Table of contents
Conductive filament formation failure in a printed circuit board
Keith Rogers, Craig Hillman, Michael Pecht, Suzanne NachborA defective printed circuit board assembly that exhibited excessive current leakage was examined to determine the responsible failure mechanisms. Observation of the failure site…
Manufacture of high density interconnection substrates by co‐lamination of inner layers and programmed interconnection joining layers
Joseph Fjelstad, Konstantine Karavakis, Belgacem HabaWhile promising significant improvements in the cost and performance of electronic systems, the advent of new area array packaging concepts such as the BGA and newer area array…
Experimental investigation of 355nm Nd:YAG laser ablation of RCCR in PCB
Winco K.C. Yung, J.S. Liu, H.C. ManDiameter and depth of craters and removing efficiency of the material of RCCR (resin coated copper) used in PCB by a single pulse energy of 355nm YAG laser with a variety of pulse…
Performance and reliability issues for a graphite based direct metalization process
Michael CaranoWhile the interest in alternative metalization processes for the manufacturing of printed wiring boards is extremely keen, the long‐term reliability of plated through holes…
Gold and aluminum wire bonding to palladium surface finishes
Chonglun Fan, Joseph A. Abys, Alan BlairPalladium surface finishes are utilized on leadframes, printed wiring boards and automobile sensors. Their superior functional performance and the considerable environmental…
Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards
C. Hillman, K. Rogers, A. Dasgupta, M. Pecht, R. Dusek, B. LorenceThis paper presents the defects that occur during the assembly and manufacturing of solder joints in single‐sided insertion‐mount printed wiring boards (PWBs). Each type of defect…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari