Table of contents
Investigation, analysis and determination of inclusions in high‐tolerance board design
A.V. Scott, W.J. BuchananThis paper outlines the inclusions in laminates that can cause the false rejection in printed circuit board (PCB) manufacture. Laminate inclusions are now becoming prevalent…
ITRI project on electroless nickel/immersion gold joint cracking
B F.D.A problem exists with electroless nickel/immersion gold (E.Ni/I.Au) board surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel…
Environmental issues in electronics manufacturing: a review
Brian EllisThis is a review paper, covering the various concerns that the electronics manufacturing industries are currently addressing, except for semiconductor manufacturing. These include…
An overview of microvia technology
John H. Lau, Chris ChangThere are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller…
Comparison of the dielectric constant and dissipation factors of non‐woven aramid/FR4 and glass/FR4 laminates
Subhotosh KhanPermittivity and dissipation factor (Dk and Df) are effects of polarization of different components of the dielectric substrate material when subjected to an electrical field. A…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari