Table of contents
Open trace defects in FR4 printed circuit boards
Sanka Ganesan, Michael PechtTo present and discuss open trace defects uncovered in an FR4 assembly during electrical testing.
Characterization of organic multi‐mode optical waveguides for electro‐optical printed circuit boards (EOPCB)
Li‐Cheng Shen, Wei‐Chung Lo, Hsiang‐Hung Chang, Huan‐Chun Fu, Yuan‐Chang Lee, Yu‐Chih Chen, Shu‐Ming Chang, Wun‐Yan Chen, Ming‐Chieh ChouTo characterise the optical performance of organic multi‐mode optical waveguides integrated with printed circuit board (PCB) and to demonstrate the feasibility of 2.5 and 10 Gbps…
Direct immersion gold (DIG) as a final finish
Shigeo Hashimoto, Masayuki Kiso, Yukinori Oda, Horoshi Otake, George Milad, Don GudaczauskasTo report on research on the alternative surface finish “direct gold on copper”, including reaction mechanism, methods of deposition and end uses.
A new fine‐grained matte pure tin for semiconductor lead‐frame applications
Keith Whitlaw, Jeff Crosby, Mike TobenTo present a new tin plating process which provides deposits having a fine‐grained structure and stable crystal orientation with a combination of properties which are well suited…
High frequency conductor loss impact of oxide and oxide alternative processes
Gary Brist, Don CullenTo examine the impact of oxide and oxide alternative processes on signal loss in commercial RF applications.
Integrated inductors on liquid crystal polymer substrate for RF applications
Gang Zou, Hans Grönqvist, Johan LiuTo investigate the fabrication of integrated inductors on a liquid crystal polymer (LCP) substrate. To analyze the RF performance of the integrated inductors.
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari