Table of contents
Pilot trials of immersion silver deposition using a choline chloride based ionic liquid
Emma L. Smith, Andrew P. Abbott, Jason Griffin, Robert C. Harris, Cecil O'Connor, Karl S. RyderThe purpose of this paper is to present the optimisation of protocols for the immersion coating of silver onto copper‐track printed circuit board (PCB) assemblies, using a novel…
Is “black pad” still an issue for ENIG?
George MiladThe purpose of this paper is to present a better understanding of nickel corrosion, also known as “black pad” during gold deposition of EN1G.
OrmeSTAR Ultra – the organic metal nanofinish
B. Wessling, M. Rischka, J. PosdorferThe purpose of this paper is to introduce a new class of surface finishes as an alternative to current final surface finishes.
Effectiveness of embedded capacitors in reducing the number of surface mount capacitors for decoupling applications
Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael PechtThe purpose of this paper is to present an analytical approach to find the reduction in the required number of surface mount capacitors by the use of embedded capacitors in…
Inner‐layer copper reliability of electroless copper processes
Crystal P.L. Li, Paul Ciccolo, Dennis K.W. YeeThe purpose of this paper is to present an overview of the alternative testing approaches that may be used to assess interconnect quality and their application to laminate…
Energy conservation and related best practices in printed circuit board (PCB) manufacturing
Martin Goosey, Rod KellnerThe purpose of this paper is to present the details of key best practices that can help printed circuit board (PCB) manufacturing companies to optimize energy consumption…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari