Circuit World: Volume 36 Issue 3

Potential low‐cost palladium‐alternatives for activating electroless copper deposition

The purpose of this paper is the investigation of the catalytic activities of selected metals in reductant oxidation.

Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticles

The purpose of this paper is to investigate if copper nanoparticles could be utilized for two types of through hole plating in printed circuit boards, namely: as a catalytic…

PCB process mechanization: various ways to automate

The purpose of this paper is to present an updated overview of printed circuit manufacturing equipment from the perspective of “mechanization strategies and systems” in order to…

Development of an ultra‐small micro drill bit for packaging substrates

The paper aims to present key points regarding the development of an ultra‐small micro drill bit for packaging substrate hole processing.

FR4 loss measurement for high volume manufacture (HVM): where next?

The paper aims to examine some of the requirements for an industrial strength loss measurement technique in FR4 laminate printed circuit boards and, in particular, to take a…

Packaging and Interconnection for Electronics and Sensors – Past, Present and Future

Printed Electronics Europe 2010, Dresden, Germany, April 13 and 14, 2010

All AT&S plants certified to ISO 9001, TS 16949, ISO 14001 and OHSAS 18001

New a revision of IPC-4202 gives updated guidance in flexible base dielectric materials

Somacis pass second NadCap audit

Du Pont and Raytheon Company honoured with 2010 IPC Corporate Recognition Awards

Labtech Ltd take delivery of a MicroCraft ELX6146 flying probe system

“Plastic electronics” and its introduction into the toy sector

Polar Instruments introduces first standalone automated generator for impedance control and lossy-line PCB coupons

International diary

ICT Northern Seminar, Darlington, UK, March 2, 2010

Graphic to expand machinery investment in Dongguan, China plant to around £32 million

Spirit circuits hold successful Open Day

Editorial

iNEMI organises four new packaging initiatives

Orbotech and mentor graphics partner in frontline PCB solutions joint venture

RUWEL’s subsidiary company NCS India successfully certified to ISO 9001

iNEMI looking to expand European participation in 2011 Roadmap

Polar Instruments appoints new CEO