Table of contents
High‐performance substrate based on a highly filled thermoplastic polymer
Thomas Apeldorn, F. Wolff‐Fabris, V. AltstädtThe purpose of this paper is to investigate and present the properties of a new substrate material based on thermoplastic polymers (so‐called LuVo Board) for high‐frequency…
Initial studies into the use of ultrasound to reduce process temperatures and chemical usage in the PCB desmear process
Andrew J. Cobley, Lindsay Edgar, Martin Goosey, Rod Kellner, Timothy J. MasonPrevious studies have proven that, under optimised ultrasonic conditions, a range of materials used in electronic manufacturing can be sonochemically surface modified using benign…
Experimental study on drilling force in printed circuit board micro drilling process
Hongyan Shi, Fumin Song, Lianyu FuThe purpose of this paper is to present a system for accurately measuring drilling force in the printed circuit board micro drilling process and to characterize the drilling force…
An innovation in horizontal processing
Peter Lymn, Ken BishopThe purpose of this paper is to detail an innovative new equipment enhancement for use in the horizontal processing of printed circuit boards (PCBs).
Printable electronics: towards materials development and device fabrication
Rabindra N. Das, How T. Lin, John M. Lauffer, Voya R. MarkovichThere has been increasing interest in the development of printable electronics to meet the growing demand for low‐cost, large‐area, miniaturized, flexible and lightweight devices…
Correction of FPC solder position error based on mutual information entropy
Jie‐xian Huang, Feng Ye, Zhi‐Jie Dong, Di LiThe purpose of this paper is to study the application of advanced computer image processing techniques for solving the problem of solder position error correction for flexible…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari