Table of contents
Integrated MEMS in package
Mark Bachman, G.P. LiThe purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for…
Inkjet printing of conductive materials: a review
Gerard Cummins, Marc P.Y. DesmulliezThe purpose of this paper is to present an exhaustive review of research studies and activities in the inkjet printing of conductive materials.
A novel flip‐chip interconnection process for integrated circuits
Mark W. Sugden, David A. Hutt, David C. Whalley, Changqing LiuThe purpose of this paper is to present an outline of the development of a new process for the formation of flip‐chip interconnections using metal coated polymer microparticles.
The influence of test method, conductor profile and substrate anisotropy on the permittivity values required for accurate modeling of high frequency planar circuits
Allen F. Horn, Patricia A. LaFrance, John W. Reynolds, John CoonrodThe purpose of this paper is to help high frequency circuit designers understand how to choose the best permittivity value for a laminate material for accurate modeling.
SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes
Jan Vanfleteren, Thomas Loeher, Mario Gonzalez, Frederick Bossuyt, Thomas Vervust, Ingrid De Wolf, Michal JablonskiIn the past 15 years stretchable electronic circuits have emerged as a new technology in the domain of assembly, interconnections and sensor circuits and assembly technologies. In…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari