Table of contents
Manufacture of an aluminum rigid‐flex circuit assembly without the use of solder
Joseph FjelstadThe purpose of this paper is to describe a novel method for the manufacture of aluminum rigid‐flex circuit assemblies without the use of solder.
Printed circuit board technologies for thermal management
William Burr, Nick Pearne, Francesca SternThe purpose of this paper is to a provide short introductory overview of metal in board (MiB) circuit technologies for use in thermal management applications.
The impact of carbon content and mesh on the characteristics of screen printed conductive structures
E.H. Jewell, S.M. Hamblyn, T.C. Claypole, D.T. GethinThe purpose of this paper is to carry out a comprehensive experimental investigation into the role of screen and conductive carbon material formulation on line conductivity and…
Development of new laminates for high performance interconnection technology in avionics applications
C.R. Raghunath, U. Raghunath, H.S. Yeshaswini, H. RashmiThe purpose of this paper is to detail various aspects of laminates and their current developments in order to enable the selection and development of appropriate laminate systems…
Analysis of structure characteristics of a flying probe tester
Chuji Chen, Hongyan Shi, Fumin SongThe purpose of this paper is to present a method for evaluating the structural dynamic characteristics of a flying probe tester.
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari