Table of contents
PCB failure analysis related to the ENIG black pad problem
Rimantas Ramanauskas, Algirdas Selskis, Jurga Juodkazyte, Vitalija JasulaitieneThe purpose of this paper is to verify the principal conclusions, done during the implementation of FP7 ASPIS project objectives in fundamental research of ENIG‐related failures…
1638
Failure mechanism of solder bubbles in PCB vias during high‐temperature assembly
Yuanming Chen, Wei He, Guoyun Zhou, Zhihua Tao, Yang Wang, Daojun LuoPb‐free soldering challenged printed circuit board (PCB) assembly with high temperature. The purpose of this paper is to explain the failure mechanism of printed circuit board…
325
Preparation and performances of coated and aluminous entry boards with endothermic and lubricant resins for PCB drilling
Hu Zhou, Ruiping Xun, Qingquan Liu, Peng WuThe purpose of this paper is to provide a new entry board for drilling holes on the PCBs, superior in heat removal effect, lubricating effect and hole locating effect in forming…
122
A solution for micro drill condition monitoring with vibration signals for PCB drilling
Qinglong An, Dapeng Dong, Xiaohu Zheng, Ming Chen, Xibin WangThe objective of this study is to develop an automated tool condition monitoring scheme for PCB drilling.
181
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari