Circuit World: Volume 39 Issue 4

Learning curve theory and innovation

– The purpose of this paper is to look at innovation and the tension which arises between proprietorship and standardization.

Self-aligned flat ultra-thin chip package for flexible circuits

Ultra-thin chip packaging (UTCP) is one of the flexible assembly technologies, by which thinned dies are encapsulated inside spin-coated dielectric films. For sake of higher…

Multi-shot printing of conductive tracks using a dry carbon nanotube ink

Wearable electronics is an emerging technology predicted to become a 50B$ industry by 2018. Components and circuits will be highly integrated into clothing and other apparel. One…

Printed silver circuits for FMCG packaging

Printed flexible circuits that combined conventional silicon technology will enable the realisation of many value added products such as smart packaging for the fast moving…

Investigation of tool wear mechanism and tool geometry optimization in drilling of PCB fixture hole

– The paper aims to investigate tool wear mechanism and tool geometry optimization of drilling PCB fixture hole.

The application of mineral casting in high-precision printed circuit board drilling machine

The purpose of this paper is to verify the feasibility and reliability of mineral casting applied in high-precision printed circuit board (PCB) drilling machine. The mechanical…

Characterization of PCB routing process and optimization of tool design based on the investigation of routing temperature

The purpose of this paper is to provide the method and system to conduct online measurement and the characterization of temperature during printed circuit board (PCB) routing…

Invotec Group develop PCBs for Europe’s most sophisticated communications satellite

Invotec Group receives Nadcap merit status for electronics

Orbotech introduces Paragon™-Xpress 50 laser direct imaging system for fine line HDI, flex and rigid-flex mass production

eXception Board announces successful completion of FastPrint acquisition for PCB Solutions business

EIPC Summer Conference, Luxembourg, 27-28 June 2013

R2i – The Research to Industry Electronics Conference Sir Dennis Rooke Building, Loughborough University, 2 July 2013

Editorial

Lackwerke Peters GmbH & Co KG was certified as Authorized Economic Operator Full (AEO-F) – customs simplifications/security and safety

IPC’S revised 2013 PCB forecast lowered but still positive

IPC and JPCA release industry’s first design guidelines for printed electronics

DKN Research creates a new advanced screen-printing process down to 30 μm silver conductors

Somacis received Nadcap merit status for electronics at its Italian facilities, covering rigid and HDI PCBs

Institute of Circuit Technology 39th Annual Symposium Gaydon, UK, 5 June 2013

Du Pont and IQLP to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications

International diary