Circuit World: Volume 40 Issue 3

UV laser cutting of glass-epoxy material for opening flexible areas of rigid-flex PCB

Shouxu Wang, Li Feng, Yuanming Chen, Wei He, Zhihua Tao, Shijing Chen, Huan Xu

The purpose of this paper is to form good cutting qualities in glass-epoxy material for opening flexible areas of rigid-flex printed circuit boards (PCB) by ultraviolet (UV) laser…

Factors governing filling of blind via and through hole in electroplating

Jing Wang, Miao Wu, Chengqiang Cui

The purpose of this paper is to present a clear picture of the key factors of blind via and through hole filling in electroplating, e.g. shape of via or hole, electroplating…

Influence of thermal deformation of drilling machine on hole registration accuracy

Haitian Zou, Baolin Wang

The purpose of this study was to investigate the thermal deformation effect of a machine tool frame on hole registration accuracy. Hole registration accuracy represents the…

Distance context based PCB film image alignment

Chengyong Zheng, Hong Li, Guokuan Li

This paper presents a novel printed circuit board (PCB) film image alignment method based on distance context of image components, which can be directly used for PCB film…